发明名称 LED APPARATUS
摘要 PURPOSE: A light emitting diode device is provided to reduce the weight of the light emitting diode device by forming a hollow part on a heat radiation protrusion. CONSTITUTION: One or more through holes(11a) are formed on a substrate(11). A heat radiation structure is installed on the through hole. A heat radiation plate(15) includes a base and a heat radiation protrusion unit(15b) which is upwardly protruded on the base. A light emitting diode(18) is mounted on the upper side of the heat radiation protrusion. A reflector(21) is installed around the light emitting diode chip.
申请公布号 KR20110052973(A) 申请公布日期 2011.05.19
申请号 KR20090109739 申请日期 2009.11.13
申请人 EXPANTECH CO., LTD.;SEMI. LINE, INC. 发明人 KIM, SUNG YOUL;JUNG, HYUN HAK;KIM, JUNG SUK
分类号 H01L33/64 主分类号 H01L33/64
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