| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead pin of a novel structure capable of providing a sufficient return amount of the lead pin, and correcting a position when reflowing a solder layer for connecting the lead pin thereto again. <P>SOLUTION: This lead pin 10 includes a shaft part 12, and a connection head part 14 formed on a tip side of the shaft part 12 and having a diameter larger than that of the shaft part 12. The connection head part 14 includes a bonding surface C on the side opposite to the shaft part 12 side. The bonding surface C has a flat surface C1 formed at the center part, a projecting surface C2 formed into a ring-like shape outside the flat surface C1 and rounded into a projecting shape at a radius R, and a recessed surface C3 formed into a ring-like shape outside the projecting surface C2 and rounded into a recessed shape at a radius R. <P>COPYRIGHT: (C)2011,JPO&INPIT |
