发明名称 METHOD OF EXPANDING CHIP INTERVAL
摘要 PROBLEM TO BE SOLVED: To appropriately remove sagging generated in an expansion tape by expanding a chip interval. SOLUTION: A plate-like workpiece 100 is supported to an annular frame 105 through an expansion tape 104; the plate-like workpiece 100 is sucked to a suction surface 200a of a workpiece holding table 20; the annular frame 105 is mounted on a frame support part 21 and held to a frame holder 6; the workpiece holding table 20 relatively moves in the vertical direction by the relationship with the frame holder 6, thereby the expansion tape 104 is expanded and the chip intervals are expanded; thereafter a sagging part is heated while gradually bringing the vertical position of the workpiece holding table 20 close to the vertical position of the frame holder 6; finally the sagging part is heated by setting both the vertical positions identical to each other; and thereby a part of the expansion tape 104 with the chips stuck thereto is prevented from being shrunk when heating and shrinking the sagging part even if large sagging is generated in the expansion tape 104. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011100920(A) 申请公布日期 2011.05.19
申请号 JP20090256013 申请日期 2009.11.09
申请人 DISCO ABRASIVE SYST LTD 发明人 MATSUYAMA O
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
主权项
地址