发明名称 X-Y PLANE CUTTING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To mount at least two kinds of cutting members, to support a material to be cut in the form according to the respective cutting members, to reduce labor of cutting machining, and to reduce cutting machining cost. <P>SOLUTION: When a material to be cut placed on a table plate is cutting-machined by two-dimensionally moving the cutting means by a traveling frame moved in a longitudinal direction and a traveling body moved in a direction perpendicular to the longitudinal direction, respective support members are moved to a lower position by a lifter and the material to be cut placed on the table plate is sucked at negative pressure to make it fixable. Whereas, when the material to be cut placed on the table plate is cutting-machined by two-dimensionally moving a laser light output device by the traveling frame moved in the longitudinal direction and the traveling body moved in the direction perpendicular to the longitudinal direction, the respective support members are moved to an upper position by the lifter, and the material to be cut is upwardly lifted from the table plate and is supported in the non-contact state. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011098415(A) 申请公布日期 2011.05.19
申请号 JP20090254846 申请日期 2009.11.06
申请人 STAR TECHNO CO LTD 发明人 HISHIKAWA TATSUMI
分类号 B26D9/00;B23K26/10;B23K26/38;B26D5/00;B26D7/02;B26D7/20 主分类号 B26D9/00
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