| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board which can more reduce a bus line for power supply than before. SOLUTION: The method has a first process which laminates a first metal layer on one surface of an insulating layer, a second process which laminates a metal layer with a carrier in which a second metal layer and a carrier layer thicker than the second metal layer are laminated so as to be exfoliated so that the second metal layer faces the other surface of the insulating layer, a third process which connects the first metal layer and the second metal layer, a fourth process which forms a first wiring pattern including the first metal layer by patterning the first metal layer, a fifth process which forms a third metal layer on the first wiring pattern made to be electrically conductive to the second metal layer by an electrolytic plating method using the second metal layer as a bus line for power supply, a sixth process which exfoliates the carrier layer from the second metal layer, and a seventh process which forms a second wiring pattern including two metal layers by patterning the second metal layer after the fifth process and the sixth process. COPYRIGHT: (C)2011,JPO&INPIT |
