发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device that is optimized with respect to cooling capability and flow of a cooling medium. SOLUTION: The present invention relates to the cooling device for electronic equipment generating heat during operation, that is, the cooling device including a cooling insert 8 for defining a cooling duct where the cooling medium flows. The cooling device 1 includes a closed cooling medium-sealing housing 2 in which the cooling insert 8 is disposed so as to be optimized with respect to, especially, the cooling capability and flow of the cooling medium. The housing 2 has at least two openings 15, 18 enabling the cooling medium to enter the housing and exit from the housing. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011101001(A) 申请公布日期 2011.05.19
申请号 JP20100237052 申请日期 2010.10.22
申请人 DR ING HCF PORSCHE AG 发明人 HOHENSTEIN JONAS;HURMER PAUL;SCHWEIZER ARMIN
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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