| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a power semiconductor module on a printed wiring board, which can prevent a solder bridge between lead terminals of the power semiconductor module and effectively makes good use of a space of the printed wiring board. SOLUTION: The mounting structure includes: the power semiconductor module 2 having a plurality of lead terminals; and the printed wiring board 1 provided with through-holes into which the lead terminals are inserted from an upper surface, wherein lands 14a, 14b are provided on both surfaces of opening edges of some of the penetration holes of the printed wiring board 1, through-hole plating 15 is applied to inner wall surfaces of the through-holes and both surfaces of the lands 14a, 14b to form through-holes 13a, 13b having affinity with solder and another through-hole adjacent to the through-holes 13a, 13b is made a non-through hole 16 having no affinity with the solder. Then, silk 12 is formed on the lower surface of the printed wiring board 1 except for the lands 14a, 14b. COPYRIGHT: (C)2011,JPO&INPIT
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