SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER

摘要

Disclosed is a method for manufacturing a semiconductor device, which is provided with: a step of forming an adhesive layer by forming a film of an adhesive composition on the semiconductor wafer surface on the reverse side of the circuit surface; a step of bringing the adhesive layer into a B-stage by irradiating the adhesive layer with light; a step of cutting the semiconductor wafer into a plurality of semiconductor chips by cutting the semiconductor wafer with the adhesive layer thus brought into the B-stage; and a step of bonding the semiconductor chip with a supporting member or with other semiconductor chip by means of pressure-bonding with the adhesive layer therebetween.