| 发明名称 |
ADHESIVE COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
Disclosed is an adhesive composition for semiconductor, which is characterized by containing (A) a radiation polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin. The adhesive composition for semiconductor is also characterized in that the component (A) contains a compound that is in a liquid state at 25°C and has one carbon-carbon double bond in each molecule. |
| 申请公布号 |
WO2011058997(A1) |
申请公布日期 |
2011.05.19 |
| 申请号 |
WO2010JP70017 |
申请日期 |
2010.11.10 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;FUJII SHINJIRO |
发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;FUJII SHINJIRO |
| 分类号 |
H01L21/52;C09J4/02;H01L21/301 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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