发明名称 WIRING BOARD, AND ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board high in the degree of freedom of a wire layout, and capable of transmitting a signal in high quality. <P>SOLUTION: First and second wires 11, 12 crossing each other are formed on this wiring board. In this case, the first wire 11 is formed in a first layer in a crossing region AR1, and formed in the first layer, a second layer lower than the first layer, and a third layer between the first and second layers in peripheral regions AR2. The second wire 12 is formed in the second layer in the crossing region AR1, and formed in the first layer, the second layer and the third layer in the peripheral regions AR2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011100871(A) 申请公布日期 2011.05.19
申请号 JP20090254985 申请日期 2009.11.06
申请人 FUJITSU LTD 发明人 ISHIZUKA TAKESHI;AKABOSHI TOMOYUKI
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
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