| 摘要 |
PROBLEM TO BE SOLVED: To use a cone part of a single crystal ingot manufactured by an FZ method as an ingot for a new wafer and obtain a wafer of high quality. SOLUTION: The cone part 11 is cut from the single crystal ingot 10, which has the cone part 11 and a straight body part 12 and is manufactured by the FZ method, in a direction orthogonal to a central axis X of the single crystal ingot 10. The cone part 11 is used as the ingot 14 for a small diameter wafer to obtain a small diameter wafer 30 having a diameter W1 smaller than a diameter W of a wafer obtained from the straight body part 12. COPYRIGHT: (C)2011,JPO&INPIT |
