发明名称 WIRE SAW AND MANUFACTURING METHOD OF WIRE SAW
摘要 PROBLEM TO BE SOLVED: To provide a fixed abrasive grain type wire saw which can solve such a problem of a resin bond method that a life is short, such a problem of an electrodeposition method that a productivity is low and a cost is high and such a problem of a brazing method that a high carbon steel cannot be used, resulting in cost disadvantages, and which can adjust a quantity of abrasive grains, has a long life and is high in productivity. SOLUTION: A soldered and plated layer 13 is previously formed on a surface of a wire 10. The abrasive grains 14 are dispersed and stuck to the soldered and plated layer 13 in a single layer. Then, the surface of the soldered and plated layer 13 is molten and solidified to obtain an abrasive grain temporarily bonded wire 12 having the abrasive grains 14 connected on their stuck surface. The abrasive grain temporarily bonded wire 12 is plated with metal to fix the abrasive grains on the surface of the wire by a metal plated layer 16. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011098407(A) 申请公布日期 2011.05.19
申请号 JP20090254310 申请日期 2009.11.05
申请人 NAKAMURA CHOKO:KK 发明人 OTANI YASUHIKO;SHIMADA HIDEAKI;TOMIYOSHI TSUTOMU;FUKUMOTO SEIJI;SHIMONO KAZUHIRO
分类号 B24D11/00;B24B27/06;B24D3/00;B24D3/06;B28D5/00 主分类号 B24D11/00
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