发明名称 |
Endoscopic camera module package and method of manufacturing the same |
摘要 |
There is provided an endoscopic camera module package including: a lens part including at least one lens arranged along an optical axis; a flexible printed circuit board having an image sensor mounted thereon, the image sensor allowing light passing through the lens part to form an image; and a housing including an image sensor supporting frame allowing the image sensor to be supported at a rear of the lens part while the flexible printed circuit board is bent.
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申请公布号 |
US2011118549(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
US20100926081 |
申请日期 |
2010.10.25 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HAN JOON HYUK |
分类号 |
A61B1/04;H01R43/00 |
主分类号 |
A61B1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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