发明名称 Endoscopic camera module package and method of manufacturing the same
摘要 There is provided an endoscopic camera module package including: a lens part including at least one lens arranged along an optical axis; a flexible printed circuit board having an image sensor mounted thereon, the image sensor allowing light passing through the lens part to form an image; and a housing including an image sensor supporting frame allowing the image sensor to be supported at a rear of the lens part while the flexible printed circuit board is bent.
申请公布号 US2011118549(A1) 申请公布日期 2011.05.19
申请号 US20100926081 申请日期 2010.10.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HAN JOON HYUK
分类号 A61B1/04;H01R43/00 主分类号 A61B1/04
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