发明名称 GROUP III NITRIDE LAMINATED SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a group III nitride laminated substrate that suppresses the occurrence of cracking and has improved crystallinity. <P>SOLUTION: The group III nitride laminated substrate includes a silicon substrate, a distorted superlattice laminate formed on the silicon substrate, and a group III nitride laminate grown on the distorted superlattice laminate. The distorted superlattice laminate is provided with at least a first superlattice laminate and a second superlattice laminate in order from the side of the silicon substrate, wherein the first superlattice laminate is formed by piling up an AlN layer and a GaN layer alternately, the second superlattice laminate is formed by piling up an AlN layer and an Al<SB>x</SB>Ga<SB>1-x</SB>N(0<x<1) alternately, and the total thickness of the first superlattice laminate exceeds 1 &mu;m. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011100772(A) 申请公布日期 2011.05.19
申请号 JP20090252982 申请日期 2009.11.04
申请人 DOWA ELECTRONICS MATERIALS CO LTD;NAGOYA INSTITUTE OF TECHNOLOGY 发明人 EGAWA TAKASHI;SAKAMOTO RYO;ITO TSUNEO
分类号 H01L21/205;C23C16/34;H01L21/338;H01L29/778;H01L29/812;H01L33/32 主分类号 H01L21/205
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