| 摘要 |
PROBLEM TO BE SOLVED: To provide a power circuit wiring structure which includes a plurality of heat dissipation parts which can decrease a temperature rise of a pattern on a printed board packaging a power circuit component, and have a fine heat-dissipating characteristic, and includes a heat dissipation member which can secure a safe insulating distance. SOLUTION: A heat dissipation member 2 having a plurality of heat dissipation parts 3, 4, and 5 insulated electrically includes a structure in which heat dissipating patterns 22, 23, and 24 disposed on a packaging printed board 21 and heat dissipation parts 3, 4, and 5 of the heat dissipation member 2 are installed on the packaging printed board 21 packaging the power circuit component by thermal coupling and connection terminals 6, 7, and 8 serving as locking means. COPYRIGHT: (C)2011,JPO&INPIT |
