发明名称 |
INSULATING STRUCTURE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>Provided is an insulating heat conductive structure having excellent heat conductivity and stability to thermal deformation due to temperature cycle and the like. In a method for manufacturing the insulating heat conductive structure, an insulating layer and a circuit layer are provided in this order from the side of a metal base material at least on a part of the surface of the metal base material, and the insulating layer is formed of a composite phase composed of a ceramic phase and a resin phase. On the cross-section of the insulating layer, the ceramic phase composed of a large number of deposited ceramic particles is formed in a plurality of independent patterns and in a state where a part of the ceramic phase is embedded in the metal base material and the circuit layer, and the spaces between the ceramic phases are filled with the resin phase.</p> |
申请公布号 |
WO2011058607(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
WO2009JP06063 |
申请日期 |
2009.11.13 |
申请人 |
HITACHI, LTD.;SATO, KEISHI;ISHIHARA, SHOSAKU |
发明人 |
SATO, KEISHI;ISHIHARA, SHOSAKU |
分类号 |
H01L23/36;C23C24/04;H01L25/07;H01L25/18 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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