| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of improving throughput, and suppressing degradation of the operation rate of the entire apparatus even when trouble occurs. <P>SOLUTION: In this substrate processing apparatus, on the rear stage side of a substrate carry-in block including a carry-in/out arm B for transferring a wafer to a carrier C, a first processing block 31, a second processing block 32, and a third processing block 33 are sequentially disposed. In the substrate carry-in block, transfer stages (21a, 21b) for transferring a wafer from the carry-in/out arm B to the first processing block 31, a transfer stage 22 for transferring a wafer to the second processing block, and a transfer stage 23 for transferring a wafer to the third processing block are arranged; the wafer on the transfer stage 22 is directly carried to the second processing block 32 by a first direct carrying mechanism A1, and the wafer on the transfer stage 23 is directly carried to the third processing block 33 by a second direct carrying mechanism A2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
