| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical module easily housed in the casing of an optical transceiver. SOLUTION: The optical module 1 includes a laminated ceramic package 2 having ceramic layers 4-6 and incorporating an optical element, and a flexible substrate 3 soldered to the bottom of the laminated ceramic package 2. A side surface 4a of a lower ceramic layer 4 or the lowermost layer of the laminated ceramic package 2 is positioned inward of a corresponding side surface 5a of an intermediate ceramic layer 5 laminated on the lower ceramic layer 4. A half via 10 is provided in the side surface 4a of the lower ceramic layer 4. The flexible substrate 3 is soldered to the bottom of the lower ceramic layer 4, and extends sideward of the side surface 4a of the lower ceramic layer 4. A solder fillet is formed in the half via 10 when connecting the laminated ceramic package 2 to the flexible substrate 3. COPYRIGHT: (C)2011,JPO&INPIT |
