| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation and vibration resistance device for a substrate that provides duct effect on cooling air and achieves vibration resistance for the substrate. SOLUTION: The present invention is characterized in including the substrate housed in a housing and mounted with a heat-generating component with a heat sink, a frame attached to the substrate and having an opening into which the heat sink is inserted, and projections provided on both sides of the opening of the frame, wherein a duct in which the cooling air flows is formed of the frame and an adjacent substrate or structure. COPYRIGHT: (C)2011,JPO&INPIT
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