| 摘要 |
An integrated circuit (IC) die includes a high capacitance solid state circuit region configured to perform predetermined operations and an RFID block configured for wireless communication with an external source. The RFID block is configured to record results from a plurality of stages of a manufacturing process. The RFID block is further configured to generate an internal BIST command in response to an external command wirelessly received by the RFID. The integrated circuit die also includes a built-in self-test (BIST) block coupled to carry out testing of the high capacitance solid state circuit region in response to the internal BIST command. The RFID block is configured to be capable of storing store information relating to the testing. The RFID block is further configured to enable wireless retrieval of the test results from the testing of the high capacitance solid state circuit region.
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