BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A board on chip package substrate and manufacturing method thereof are provided to obtain a larger number of input/output paths by flip chip type connection, thereby realizing high densification. CONSTITUTION: A circuit pattern(12) and a flip chip bonding pad(14) are formed on an insulator(10). A conductive bump(15) contacts the bottom of the circuit pattern. A solder resist layer(20) is formed on the insulator. A flip chip bonding pump is formed on the flip chip bonding pad. A solder ball(50) is coupled with the bottom of a conductive bump penetrating the insulator.