发明名称 METHOD FOR MANUFACTURING SOUNDPROOF BOARD BY THERMOCOMPRESSION BONDING
摘要 PURPOSE: A method for manufacturing thermo-compression bonded sound-insulation boards is provided to prevent the decrease of durability by preventing the distortion and separation of sound-insulation boards. CONSTITUTION: A method for manufacturing thermo-compression bonded sound-insulation boards is as follows. A fine recessed grooves is formed on a soft thermoplastic resin sheet by making LDP(Low Density Polyethylene) soft thermoplastic resin sheet(2) embossed on an embossing roller having embossing unevenness. The bottom part of each fine recessed groove is stretched in 1~10 micron meters. An interior material(10), a board-shape soundproof material(12), a soft resin sheet, an exterior nonwoven fabric(14) are successively laminated in order to form a molding object. The gas generated from the heated soundproof material is exhausted through temporary through-holes. A molding product(40) is frozen to close inside temporary through-holes of fine recessed groove of soft thermoplastic resin sheet. The soft thermoplastic resin sheet hardens along with the soundproof material and the exterior nonwoven fabric. An adhesion waterproof film is formed, and the plate shape sound insulator is manufactured.
申请公布号 KR20110051952(A) 申请公布日期 2011.05.18
申请号 KR20090108780 申请日期 2009.11.11
申请人 WOOJIN TECH CO., LTD. 发明人 SHIN, KYUNG HAK
分类号 B29C59/04;B29C43/20;B29C43/28 主分类号 B29C59/04
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