| 摘要 |
PURPOSE: A chemical mechanical polishing composition is provided to enable use for the polishing of a substrate including silicon oxide materials and silicon nitride materials. CONSTITUTION: A chemical mechanical polishing composition comprises a first material of chemical formula 1 as a initial ingredient, a second material of chemical formula 2, abrasive and water. In chemical formulas, R^1, R^2, R^3, R^4, R^5, R^6 and R^7 are respectively a -(CH2)n- bridging group, wherein n is an integer of 1-10; R^8, R^9, R^10, R^11 and R^12 are respectively selected from hydrogen and C1-6 alkyl groups, and two or more of R^8, R^9, R^10, R^11 and R^12 are bonded to form a ring structure. |
