LEADFRAME AND METHOD OF MANUFACTURIG SAME

摘要

PURPOSE: A lead frame and manufacturing method thereof are provided to connect a lead unit with a chip by a circuit pattern whose thickness is uniform, thereby slimming the lead frame while constructing a large number of signal transfer systems. CONSTITUTION: A die pad unit is disconnected from a lead unit made of first metal by an insulating unit. The upper width of the lead unit is narrower than the lower width of the lead unit. A circuit pattern is made of second metal on the lad unit and the insulating unit. An inner lead(190) is formed on the circuit pattern. An outer lead(185) is formed on the bottom of the lead unit.