发明名称 |
MODIFIER FOR RESIN AND RESIN COMPOSITION USING THE SAME AND FORMED ARTICLE |
摘要 |
<p>A modifier for resin has an average particle size of 20 µm or more, wherein particles having an average particle size of 10 µm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 µm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.</p> |
申请公布号 |
EP1724299(B1) |
申请公布日期 |
2011.05.18 |
申请号 |
EP20050719112 |
申请日期 |
2005.02.15 |
申请人 |
MITSUBISHI RAYON CO., LTD. |
发明人 |
WAKITA, TSUNEKI;NAKAMURA, KEIJI;MAKINO, HIDEAKI;OSUKA, MASAHIRO;MIWA, YOHEI;DOI, YASUTAKA |
分类号 |
C08K5/00;C08F265/04;C08F279/02;C08F283/12;C08J3/12;C08L33/04;C08L51/00;C08L51/04;C08L51/08;C08L101/00;H01L23/29 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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