| 摘要 |
<p>Microstrip devices for impedance matching of microwave power transistors in a hybrid microwave IC Repeatable and compact input and output impedance matching of a microwave power transistor 41 is provided by use of series transmission lines 31,31â disposed in or on a substrate 32,32â with high dielectric constant. The inductances of the bondwires 43,44, which need only be short, are absorbed into the series inductance of the transmission lines which may be of microstrip or coplanar construction. The matching technique minimises the circuit-to-circuit variations found in matching arrangements using chip capacitors in conjunction with bondwires (figure 1).</p> |
