| 摘要 |
<p>The present invention provides an aqueous CMP slurry composition that includes abrasive particles and from about 0.01% to the limit of solubility in water of a compound according to Formula (I): wherein only one of R1, R2, R3, R4 and R5 is a hydroxyl group (—OH), only one of R1, R2, R3, R4 and R5 is a methoxy group (—OCH3), and the three of R1, R2, R3, R4 and R5 that are not either a hydroxyl group (—OH) or a methoxy group (—OCH3) are hydrogen atoms (—H).</p> |
