LEADFRAME AND METHOD OF MANUFACTURIG SAME

摘要

PURPOSE: A lead frame and manufacturing method thereof are provided to supply insulator support power, thereby increasing physical strength. CONSTITUTION: A lead unit is made of a vertical unit and a horizontal unit. A die pad unit is disconnected from the lead unit by an insulating unit(170). An insulating layer(180) is formed on the insulating unit exposed by etching. A wire(210) connects a semiconductor chip(220) with an inner lead. The inner lead is formed on the horizontal unit of the lead unit.