ELECTRICAL DEVICE MANUFACTURING TECHNIQUES

摘要

The present invention relates to a method of making an RFID transponder comprising:
placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate;
heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate;
embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and
coupling the chip to an antenna structure, wherein the coupling includes:
depositing the antenna structure with conductive ink onto the thermoplastic substrate; and
connecting the antenna structure to the interposer leads of the RFID interposer.