| 摘要 |
A method of manufacturing an electronic device includes the steps of: forming a conductive pattern (112) on a film (111) made of a resin material and thereby forming a base body (11) on which a circuit chip (12) is mounted; forming a reinforcing layer that suppresses expansion and contraction of the film in either one of a mounting area (11c) on the film which area the circuit chip is mounted on and a rear area at the back of the mounting area; applying a thermosetting adhesive (13); mounting the circuit chip; pinching the base body mounted with the circuit chip by a heating device that heats the thermosetting adhesive and has a pressing section and a supporting section; and fixing the circuit chip to the conductive pattern by hardening the thermosetting adhesive through heating by the heating device. |
