APPARATUS AND METHOD FOR PLATING SUBSTRATE

摘要

PURPOSE: A device and a method for plating substrates are provided to perform plating processes without the turning of substrates since the plated surface of a substrate is faced upward and supported. CONSTITUTION: A substrates plating device comprises a substrate support member, an anode electrode, a power source, a plating liquid feed member, a plating bath(240), and a first drive unit. The substrate support member supports the substrate so the plated surface of the substrate is faced upward. The anode electrode is placed on the top of the substrate support member. The power source applies voltage on anode electrode and substrate. The plating liquid supply member supplies the plating liquid to the substrate. The plating liquid feed member is placed on the top of the anode electrode. The plating liquid feed member comprises a plating liquid nozzle. The plating liquid nozzle discharges plating liquid downward. The plating bath has an opened lower part. The plating bath accepts the plating liquid nozzle and an anode electrode inside. The first drive unit elevates the substrate support member to open and close the opened lower part of the plating bath.