The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.
申请公布号
US7943490(B2)
申请公布日期
2011.05.17
申请号
US20080051687
申请日期
2008.03.19
申请人
FUKUI PRECISION COMPENENT(SHENZHEN) CO., LTD.;FOXCONN ADVANCED TECHNOLOGY INC.