发明名称 METHOD AND APPARATUS FOR FORMING POLYMERIZED FILM
摘要 A first substrate has a source material forming surface on which source materials for forming a polymerized film is formed in a predetermined pattern, and a second substrate has a film forming surface on which the polymerized film will be formed. Here, the first substrate and the second substrate are installed in a processing chamber such that the source material forming surface and the film forming surface face each other. Then, the first substrate is heated to a first temperature at which the source materials on the source material forming surface are evaporated and the second substrate is heated to a second temperature at which the source materials cause polymerization reaction on the film forming surface. Therefore, the polymerized film is formed on the film forming surface by reacting the source materials and evaporated from the first substrate on the film forming surface of the second substrate.
申请公布号 KR20110051250(A) 申请公布日期 2011.05.17
申请号 KR20117006035 申请日期 2009.07.17
申请人 TOKYO ELECTRON LIMITED 发明人 KAWANO YUMIKO;KASHIWAGI YUSAKU
分类号 H01L21/312;C08G73/10;C23C14/12 主分类号 H01L21/312
代理机构 代理人
主权项
地址