APPARATUS FOR ATOMIC LAYER DEPOSITION

摘要

PURPOSE: An atomic layer depositing device is provided to improve the density and corrosion resistance of a thin film by supplying plasma in the same chamber. CONSTITUTION: A process chamber provides a space for a deposition process on a substrate(10). A gas spray unit(103) is formed on the upper side of the process chamber and sprays deposition gas to the substrate. A susceptor(102) is included in the process chamber. A plasma processing unit(104) includes a pair of electrode plates(141) vertical to the substrate. The plasma processing unit includes a power supply unit(142) for applying power to the electrode plate.