A CARRIER MEMBER FOR MANUFACTURING A SUBSTRATE AND A METHOD OF MANUFACTURING A SUBSTRATE USING THE SAME

摘要

PURPOSE: A carrier member for manufacturing a substrate and a method for manufacturing the substrate using the same are provided to reduce the manufacturing costs by utilizing the parts of the carrier member as a pad or a stiffener of the printed circuit board. CONSTITUTION: A carrier member(100) for manufacturing a substrate comprises two metal layers(110) and two insulating materials(120). A non-penetrated hall(115) of the desired pattern is formed on one side of the carrier member for manufacturing a substrate constituted. A metal layer acts a role as a release layer for separating the carrier member. An insulating material uses a prepreg with a superior adhesive force.