A PROCESS WHICH PROTECTS OVERFLOWING OF PROPELLENT FOR I.C CARD THAT INCLUDES HEATSLUG

摘要

PURPOSE: A method for preventing a filling flash of an ic card including a heat resistant plate are provided to simplify a process through a removal of a processing unnecessary for reproducing process. CONSTITUTION: A surface which adhesive is spread of a heat resistant tape is adhered to upper surface of the heat generation plate by adding heat and pressure(10). A heat generation plate is attached to a substrate included in a chip of an IC card(20). The IC card is inserted into a mold an is molded(30). The heat resistant tape is removed from an IC card package(40). The IC card package is cut according to a standard of the IC card(50).