| 摘要 |
A method of manufacturing a GaN-based field effect transistor is provided by which a lower resistance and a higher breakdown voltage are obtained and which is less affected by a current collapse. A method of manufacturing the GaN-based field effect transistor(s) can comprise performing an epitaxial growth of an AlN layer (102), of a buffer layer (103), of a channel layer (104), of a drift layer (105) and of an electron supplying layer (106) in such the order on to a substrate (101) respectively; forming a recess part (108) thereon; performing an alloying process for performing an annealing in order to obtain an ohmic contact; forming a passivation layer (113) at a period of performing the annealing in the alloying process in order to protect the electron supplying layer (106) on to a surface of the recess part (108), on to the electron supplying layer (106), on to a source electrode (109) and on to a drain electrode (110), respectively; removing the passivation layer (113); forming a gate insulating film on to a surface at the inner side of the recess part (108), on to the electron supplying layer (106), on to the source electrode (109) and on to the drain electrode (110), respectively; and forming a gate electrode on to the gate insulating film at a part of the recess part (108).
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