发明名称 |
Method and structure of expanding, upgrading, or fixing multi-chip package |
摘要 |
Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.
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申请公布号 |
US7944047(B2) |
申请公布日期 |
2011.05.17 |
申请号 |
US20070860985 |
申请日期 |
2007.09.25 |
申请人 |
QIMONDA AG |
发明人 |
OH JONG HOON;HUMMLER KLAUS;KIEHL OLIVER;SCHNELL JOSEF;ELLIS WAYNE FREDERICK;KIM JUNG PILL;COLLINS LEE WARD;BELDIMAN OCTAVIAN |
分类号 |
H01L21/00;H01L23/34 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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