发明名称 Nonvolatile memory devices having stacked structures and methods of fabricating the same
摘要 A memory device includes a first active region on a substrate and first and second source/drain regions on the substrate abutting respective first and second sidewalls of the first active region. A first gate structure is disposed on the first active region between the first and second source/drain regions. A second active region is disposed on the first gate structure between and abutting the first and second source/drain regions. A second gate structure is disposed on the second active region overlying the first gate structure.
申请公布号 US7943998(B2) 申请公布日期 2011.05.17
申请号 US20070668115 申请日期 2007.01.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YUN EUN-JUNG;LEE SUNG-YOUNG;KIM MIN-SANG;KIM SUNG-MIN;YEO KYOUNG-HWAN
分类号 H01L29/66;H01L29/792 主分类号 H01L29/66
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