发明名称 Heat spreader with vapor chamber
摘要 A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the lower plate and the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomboid apertures communicating with each other for containing the working liquid therein.
申请公布号 US7942196(B2) 申请公布日期 2011.05.17
申请号 US20070964912 申请日期 2007.12.27
申请人 FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 LAI CHENG-TIEN;ZHOU ZHI-YONG;DING QIAO-LI
分类号 F28D15/00;H05K7/20 主分类号 F28D15/00
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