发明名称 |
Semiconductor wafer sawing system and method |
摘要 |
Semiconductor wafer sawing systems and methods are described in which a wafer may be secured in a sawing position having a surface exposed to incur sawing with at least a portion of the exposed wafer surface positioned below the center of gravity of the wafer such that prevailing force of gravity may be used to assist in the removal of contaminants from the wafer.
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申请公布号 |
US7943425(B2) |
申请公布日期 |
2011.05.17 |
申请号 |
US20090402058 |
申请日期 |
2009.03.11 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ANCHETA PATRICIO VERGARA;VILAGA HEINTJE SARDONAS;SARMIENTO ELLA CHAN |
分类号 |
H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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