Semiconductor package having an antenna on the molding compound thereof

摘要

The present invention relates to a semiconductor package having an antenna. The semiconductor package includes a substrate, a chip, a molding compound and an antenna. The substrate has a first surface and a second surface. The chip is disposed on the first surface of the substrate, and electrically connected to the substrate. The molding compound encapsulates the whole or a part of the chip. The antenna is disposed on the molding compound, and electrically connected to the chip. The antenna is disposed on the molding compound that has a relatively large area, so that the antenna will not occupy the space for the substrate.