PRINTED CIRCUIT BOARD HAVING VDD PADS CONNECTED TO EACH OTHER

摘要

PURPOSE: A printed circuit board including VDD pads is provided to stably operating a semiconductor chip by forming a connection type VDD pad on a package substrate mounting area. CONSTITUTION: A plurality of VDD pads(134) are mounted on a package substrate mounting area of a printed circuit board(130). Voltage is applied to a VDD terminal of the package substrate through the VDD pads. A circuit pattern(136) is connected to two or more VDD pads in which different voltage are applied. The VDD pads and a connection circuit pattern are integrally formed by the same manufacturing processes.