发明名称 Hillock-free aluminum layer and method of forming the same
摘要 A hillock-free conductive layer comprising at least two aluminum (Al) layers formed on a substrate, wherein said at least two Al layers comprise a barrier Al layer formed on the substrate, and a pure Al layer formed on the barrier Al layer. The barrier Al layer could be an aluminum nitride (AlNx) layer, an aluminum oxide (AlOx) layer, an aluminum oxide-nitride (AlOxNy) layer, or an Al—Nd alloy layer. Also, the pure Al layer is physically thicker than the barrier Al layer, for effectively inhibiting the occurrence of hillocks and the like.
申请公布号 US7944056(B2) 申请公布日期 2011.05.17
申请号 US20070802350 申请日期 2007.05.22
申请人 CHIMEI INNOLUX CORPORATION 发明人 CHANG KUNG-HAO;YEH SHYI-MING;YIN JUI-TANG
分类号 H01L21/28;H01L23/48;B32B3/00;B32B15/04;C23C14/00;H01L21/3205;H01L23/52;H01L29/40;H01L29/423;H01L29/49;H01L29/786 主分类号 H01L21/28
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