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发明名称
method of forming a via pattern structure and method of measuring resistance of the via pattern structure
摘要
申请公布号
KR101034634(B1)
申请公布日期
2011.05.16
申请号
KR20080120495
申请日期
2008.12.01
申请人
发明人
分类号
H01L21/027
主分类号
H01L21/027
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代理人
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