| 摘要 |
A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern. |
