BELEUCHTUNGSEINHEIT

摘要

The illuminating device (12) has a cooling body (4) on each side of a laminar support part (3). A light emitting semiconductor component (6) i.e. high efficiency LED, is fed via a through hole of the support part by a heat-conducting unit, and is heat conductively coupled with the cooling body. The body is formed with a reflector (18) e.g. spherical concave mirror, comprising a reflecting surface (7) for bundling the light emission of the semiconductor component, which is arranged at a side of the support part. The side is turned towards the body. The reflector is made of metallic material.