| 摘要 |
PURPOSE: A solder bump forming template and a solder bump forming method using the same is provided to prevent the bending of the template due to the thermal expansion during formation of the solder pump by forming a first cavity on a first surface and a second cavity on a second surface, respectively. CONSTITUTION: A flat substrate comprises a first side(110) and a second side facing the first side. A plurality of first cavities(112) is formed on the first side of the flat substrate. A plurality of second cavities is formed on the second side of the flat substrate. A pass-through slot(130) passing through the flat substrate is formed being spaced from the plurality of first cavities. |
