INK COMPOSITION FOR FORMING CIRCUIT AND METHOD OF FORMING CIRCUIT USING THE SAME

摘要

PURPOSE: An ink composition for forming circuits is provided to ensure excellent dispersion stability, to perform thermal process at a low temperature, and to easily form electrode wiring patterns. CONSTITUTION: An ink composition for forming circuits comprises a copper-glycine composite of chemical formula 1. In chemical formula 1, M is Cu, R1 and R2 are different or the same and represent C3-C7 linear or branched alkyl group in which one or more halogens are substituted or unsubstituted. A method for forming copper circuits comprises the steps of: applying the ink composition for copper circuits to a material; and heat-treating the ink composition to form copper nanoparticle circuits from the copper-glycine composite.