SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor package and a method of forming the same are provided to protect a semiconductor chip from thermal/physical stress due to a molding film by arranging a stress alleviation unit in a semiconductor chip before forming the molding film. CONSTITUTION: In a semiconductor package and a method of forming the same, a semiconductor chip(120) is attached to a substrate(100) through an adhesive. At least one stress alleviation unit(200) is arranged in one side of the semiconductor chip. The semiconductor chip includes a weak part. The stress alleviation unit is overlapped with the weak part. A molding film covers the side of the stress alleviation unit and at least part of the semiconductor chip.